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Home > Products > BGA Rework/Reballing Tools/Repairing Tools

BGA Thermal gap pad for computers

BGA THERMAL GAP PAD Micro processor, memory chip and graphics processor

 

Description:

1) Color:White or Blue

2) Dimension : 400mm×200mm

3) Thickness: 1mm,1.5mm, 2.0mm, 3.0mm

4) Continuous Temp: -40℃-260℃

5) Thermal Conductivity: 3.2w/m-K

6) Breakdown Voltage: 4kv/mm

7) High compressibility, soft and flexible, designed for applications in low-stress application environment

8) Nice thermal conductivity

9) Electrical insulation

10) Meet with the environmental requirements of ROHS and UL

11) Natural stickiness

Typical applications

1.Laptop

2.Communication hardware equipment

3.High-speed hard disk drive equipment

4.Automobile engine control mould

5.Micro processor, memory chip and graphics processor

6.Mobile equipment


 

Notice : You can cut the pad into different size according to your needs !

This handy thermal pad offers a mess-free installation , maximum heat conduction and increased cooling. It can be used for graphic cards , graphic chips , North-south bridge chip , memory chipset , IC, etc.

 


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Product Details
Place or Origin: CHINA
Model Number: 1MM-3MM
Type: 400mm×200mm
Applitcation: BGA maintenance
Color: blue or white
Payment & Shipping Terms
Price: get latest price from us
Minimum Order Quantity: 1pcs for each single model
Port: FOB Shenzhen, China
Packaging Details: general paper box packing
Deliver Time: 1-2 working days after receive payment
Payment Terms: T/T(bank transfer),Western Union
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