BGA Multifunctional Reballing Station Use BGA stencil templates 90x90mm.
1) The liberation of your hands to the lock mechanism, improve the work efficiency; industry first, to fill the gaps in the industry;
2) Handle under the pressure of bodies bumping stencil and IC smooth separation of the solder ball does not shift, bumping yield;
3) Screw driven support slider mobile synchronization (at the same time the relocation or move) to facilitate the positioning of the different sizes of IC;
4) Four support the four corners of the slider can IC boosting the stable manner than the diagonal positioning, improve the yield of the plant the ball;
5) Support the size of the locating slot on the slider, and the other on the small size, the smaller the IC can be used to plant the ball, larger IC can locate the four corners, good stability, planting the ball good high ;
6) Base has four height adjustment screws can be adjusted according to the different thickness of the IC support slider positioning surface and cover the distance from the plant ball steel gateway in different thickness IC bumping;
7) Superstructure with a solder balls poured trough the structure convenience of the superstructure excess solder balls poured out;
8) Superstructure inside a tin ball storage room, the structure is poured into excess solder balls not always have to pour out, but stored in the structure, improve production efficiency;
9) Generous design, reasonable structure design.
Specifications
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Product Name：
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Universal BGA Reballing Kit
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Maximum BGA Size：
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45 * 45 mm
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Minimum BGA Size：
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10 * 10 mm
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BGA Thinkness：
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≥ 0.8mm (Customized 0.30mm)
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Body Size：
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90 * 90 * 32mm
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Support Size：
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100 * 100 mm
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Hight：
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81.2 mm
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Length with handle：
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200 mm
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Weight：
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900 gram
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